The Electrovert® VectraElite™ system is the ideal wave soldering solution for medium-to-high mass board assemblies in a soldering environment that requires fast changeover, process flexibility, and system reliability. The VectraElite combines innovative technology in an accessible, ergonomic platform and provides the technologies necessary to achieve a zero-defect process at the lowest possible cost of ownership.
Proven Performance, World Class Results
Achieving the best solder joint quality, maximum topside hole fill, and zero defects are challenges with high mass, difficult-to-solder PCBs. The VectraElite’s features, including ServoJet™ fluxing, forced convection preheat, and DwellMax Plus™ solder nozzles, provide board assemblers the capability to process the most difficult soldering applications in the most demanding environments.
Lead-Free Process Capability
The VectraElite has been soldering lead-free applications for many years. The cast iron solder pot and its components are resistant to the corrosive nature of lead-free solders, and are capable of withstanding temperatures of 302° C (576° F). All stainless steel components that come into contact with the solder are composed of a special corrosion-resistant surface conversion as standard, or titanium as an option. Features such as our Quick Change solder pot provide the flexibility to easily change alloys in a safe and timely manner.
Reliability
Electrovert holds the industry reputation for building the most reliable and longest-lasting wave soldering systems. The VectraElite carries a lifetime warranty on the solder pot casting to the original owner (see the full explanation in terms and conditions).
Conveyor: Process Width Capability:
The robust conveyor is designed to handle the weight of thick boards and pallets; and automatic lead clearance adjustment is standard. A soldering process width of 457 mm (18 inches) is standard while a process width of 508 mm (20 inches) is optional.
Solder Nozzle Technologies
Electrovert has designed solder nozzles that provide board assemblers with the greatest performance, process flexibility, and process control. Electrovert holds multiple patents on various wave solder technologies. Electrovert’s UltraFill™, DwellMax Plus, and DwellMax Ultra solder nozzles are designed to provide maximum top-side hole fill, provide the best hole fill quality, improve first pass yields, reduce dross, and promote easy maintenance.
Fluxing Technologies
As the complexity of board assemblies continues to increase, fluxing quality has become more of a focus to ensure soldering quality. Electrovert offers the best fluxing technologies available. The ServoJet fluxing system provides the ultimate in precision deposition and hole penetration (OA version available for aggressive flux applications) while ServoSonic™ and ServoSpray™ fluxing systems are available for ultrasonic and value-based solutions.
Operations and Software
Electrovert’s software and operation controls were designed with user interface in mind. The Windows® operating system is multi-functional and easy to use. The 3D GUI provides the user a real-time view of the complete machine modules, operation, and product being soldered. All Electrovert systems have a customizable quick view screen that allows engineers and operators to view critical machine parameters that are important to the process or application.
UltraFill Solder Nozzle
The patented UltraFill solder nozzle is an ideal solution for lead-free soldering. The UltraFill nozzle is 40% wider than traditional tin-lead nozzle to increase contact time. The nozzle placement reduces the temperature drop between nozzles and improves hole fill. UltraFill allows either air or nitrogen operation through the same design without switching nozzles. Nitrogen or air operation can be selected through the desired recipe, without the need to change nozzles (also available with the rotary chip nozzle).
DwellMax Plus Solder Nozzle with Nitrogen Tunnel
DwellMax Plus is a patented process solution that meets the challenges of lead-free wave soldering. The extra-wide chip nozzle and modified UltraFill nozzle are ideal for soldering thick, high thermal mass circuit boards, increasing throughput capability and process flexibility across a wide range of products and applications. With conventional wave soldering technology, thick multi-layer and/or high thermal mass circuit boards are often accompanied by high cost from low yields, slow production speeds, rework costs, and the collateral damage associated with a rework loop. The innovative design of DwellMax Plus alleviates these problems and provides better PTH fill at significantly faster conveyor speeds. The benefits of the nitrogen tunnel include improved solder wetting and reduction in dross by up to 83%.
DwellMax Plus benefits include:
Electrovert’s DwellMax Plus is the key to a better bottom line through fewer defects and maximized productivity.
DwellMax™ Ultra Solder Nozzle
The DwellMax Ultra is patent pending technology that provides the highest level of soldering for thermally challenging and difficult to solder applications. With an Ultra wide single wave system, the DwellMax Ultra delivers the most thermal energy and longest dwell time capability in the industry. The DwellMax Ultra is ideal for production environments in which the production line is dedicated to thermally challenging applications and production requirements.
DwellMax Ultra benefits include:
Short Nitrogen Tunnel Feature
Electrovert’s short nitrogen tunnel utilizes patented technology that inerts at the solder wave area only. This efficient approach maintains a very low oxygen environment of <50 ppm which is ideal for increased wetting effects and a significant reduction of dross.
Full Nitrogen Tunnel Feature
Electrovert’s full nitrogen tunnel feature includes all the same features and benefits of the short tunnel plus a fully inerted preheat section. The innovative approach to inerting the preheat section allows for any preheat type (forced convection or IR) in any position and/or location without jeopardizing the inert environment inside of the tunnel.
Benefits of the nitrogen tunnel include:
ExactaWave Automatic Wave Height
ExactaWave is a patented, high-reliability sensor with closed-loop feedback designed to control the solder wave height relative to the board. Its ability withstand temperatures up to 300°C (573°F) makes it perfectly suited for precision soldering applications.
The ExactaWave system compensates for changes in solder level, dross accumulation and set-up changes made during maintenance. Thus, a set-point entered in a recipe always produces the same result. The ExactaWave’s seamless integration into the soldering machine’s software also allows it to operate in standby mode and is a parameter that can be data logged with trending capability.
ServoJet Fluxing Application System
The ServoJet system ensures thorough flux penetration by utilizing concentric air atomization. It offers a programmable method of applying flux that results in consistent flux deposition and reduced flux usage. The ServoJet utilizes air atomized multiple jet technology that is 100% integrated into the wave soldering system software.
High end fluxer capabilities include:
ServoJet benefits include:
ServoSpray Flux Application System
ServoSpray provides an ideal balance between system performance, functionality and low cost of ownership. ServoSpray has the ability to spray in one or both directions, includes self-clean capability, and features a pressure tank flux supply system. ServoSpray utilizes atomized air delivery technology and is 100% integrated into the wave solder machine software.
ServoSpray benefits include:
ServoSonic Flux Application System
The ServoSonic is a reciprocating ultrasonic atomizing spray fluxing system. It consists of an ultrasonic atomized spray nozzle and air impact nozzle with an automatic self-cleaning function. The titanium nozzle and horn assemblies make the ServoSonic an ideal solution for high solids and aggressive water soluble fluxes.
The ServoSonic benefits include:
Preheat Features
The VectraElite is capable of up to 1.8 meters (6 feet) of bottom side preheat and up to 1.2 meters (4 feet) of topside preheat. Multiple forms of preheat are offered for complete process flexibility (IsoThermal forced convection, Fast response IR, and Infrared radiant types). The optional quick plug feature allows ‘plug and play’ preheat configurations that are easy to change.
Quick Change Solder Pot
Electrovert’s quick change solder pot allows the use of two or more alloys with easy change-over of interchangeable solder pots. This feature is designed for safety, beginning with a robust cart that includes locking devices and safety bars to secure the pot. The quick-change electrical and nitrogen utilities simplify change-over while the warming station (included) significantly reduces changeover time.
Quick-change pot benefits include:
Features for Value in Wave Soldering
Electrovert’s Electra, VectraElite, and VectraES offer a wide range of features and capabilities that increase the value of the wave solder process. The value is achieved through reliability, features that provide process flexibility, maximize process control, and ultimately save time and money.
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