Orissa Synchrodex

Flexible, in-line, modular selective soldering system

Designed as a modular system, the Synchrodex range of in-line equipment offers the ultimate in flexibility with the ability to upgrade to high speed throughput when multiple modules are placed together.

Description

Supplied as standard with our patented design Drop-Jet fluxer, this system offers accurate, controlled flux deposition either prior to or during the optional top side preheat function. Preheat can be controlled via an optional top-side closed loop pyrometer system for optimum temperature profile regulation.

Our low maintenance solder bath and pump mechanism moves in three axes. Solder is applied using our proven technology single point AP nozzle design incorporating patented spiral solder return to bath technology offering increased wave stability with reduced potential for solder balls.

The system can also accommodate our latest generation micro nozzle, together with Jet-Wave, Wide-Wave and dedicated multi-tube single dip solder technology.

As with all Pillarhouse systems, the soldering process is enhanced by a hot Nitrogen curtain which provides an inert atmosphere for the soldering process and also assists in the prevention of oxidation. This process provides a local preheat to the joint thus reducing thermal shock to localised components.

The Synchrodex is controlled by a PC, through PillarCOMM, a Windows^® based ‘Point & Click’ interface with PCB image display. Additionally, our PillarPAD offline package allows the operator to produce programs independently from the machine using Gerber data.

Standard Features

In-line motor driven auto width adjust through feed synchronous movement conveyor
Conveyor side clamping
Integral PC and machine mounted TFT monitor
Auto solder wire feed and level detect
Heated inerted Nitrogen system
Drop-Jet fluxer
Set of AP solder nozzle tips
Internal fume extraction
Colour programming camera
Windows^® based PillarCOMM ‘Point & Click’ interface
Light stack
Fiducial recognition and correction system
Flux level sensor
Multiple level password protection
PillarPAD offline programming system
SMEMA compatible
Process viewing camera with record feature
Lead-free capability
Day-to-day service kit

Monitoring Options

Flux presence sensor – thermistor style
Flux spray, flow and spray & flow
Pump rpm
O₂ ppm
Nitrogen flow

System Options

Ultrasonic fluxing
Dual Drop-Jet / ultrasonic fluxing
Top-side instant IR preheat
Closed loop pyrometer temperature control
Solder wave height measurement and correction system
Bottom-side hot Nitrogen selective preheat
Laser PCB warp correction
Solder reel identification
Solder bath coding – identifies correct bath for program
Encoders on X, Y and Z axis
Nitrogen generator

Specifications

Height: 1615mm / 63” – excluding light stack
Width: 813mm / 32“
Depth: 2024mm / 80”
Board size: Max. – 457mm x 610mm / 18”x 24”
Min. – 102mm x 102mm / 4”x 4”
Edge clearance: Above/below 3mm
Height clearance: Below 40mm – above 45mm
100mm – upon request
Extraction: Fan: 276mm dia.
Rating: 1000m3/hr / 589 CFM
Solder: Most commonly used solder types – including lead-free
Solder pot capacity: 15kg standard – 25kg large bath
Applicators: AP style – 2.5 – 16mm dia.
Extended and Jet-Tip nozzles – up to 25mm dia.
Jet-Wave nozzles – up to 25mm width
150mm Wave nozzle
Flux: Low maintenance Drop-Jet system. Low solids (below 8%), no clean flux, pressurised and inerted system, optional water-soluble system available
Flux tank capacity: 1 litre
Fluxer speed: 50 dots/second
Deposition size: 4.0-6.0mm / 0.16-0.24”
X, Y & Z axis resolution: 0.15mm
Repeatability: +/- 0.05mm
Nitrogen supply pressure: 5 bar / 72 psi
Nitrogen usage: 30-100 litres/min. – solder nozzle configuration dependent
Nitrogen purity: 99.995% or better
Air supply pressure: 5 bar / 72 psi
Air usage: 10 litres/min. / 0.35 CFM
Power Supplies: Single phase + PE
Voltage: 230V
Frequency: 50/60Hz
Power: 10.5kVA max. – machine configuration dependent
Transport: Conveyor

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