The Electrovert® VectraES™ system is the wave soldering solution for low-to-medium mass board assemblies in a high volume production soldering environment that requires fast changeover, process flexibility, and system reliability.
Value Leader in Wave Soldering
As the complexity of board assemblies continues to increase, board manufactures are looking for the best solution in a wave soldering system. The solution must meet their soldering expectations for today and far into the future.
The VectraES with it’s extensive list of features utilize technologies that provide complete process flexibility and process control.
Proven Performance, World Class Results
Achieving the best solder joint quality, maximum topside hole fill, and zero defect soldering are requirements in all industries. The VectraES features such as ServoJet™ fluxing, forced convection preheat, and UltraFill™ solder nozzles provide board assemblers the capability to process the most difficult soldering applications in the most demanding environments.
Lead-Free Process Capability
The VectraES is designed to handle lead free applications for many years. The cast iron solder pot and its components are resistant to the corrosive nature of lead-free solders and are capable of withstanding temperatures of 302° C (576° F). All stainless steel components that come into contact with the solder are composed of a special corrosion resistive surface conversion as standard or titanium as an option. Features such as our Quick Change Solder Pot provide the flexibility to easily change alloys in a safe and timely manner.
Reliability
Proven performance and reliability are key. Electrovert holds the industry reputation as having the most reliable wave soldering that lasts the longest when compared to other brands. Board assemblers know the value in owning an Electrovert wave soldering system. The VectraES carries a lifetime warranty on the solder pot casting to the original owner (see the full explanation in terms and conditions).
Conveyor: Process Width Capability
The robust conveyor is designed to handle demanding production environments yet is easy to maintain. Standard features such as automatic lead clearance adjustment allow complete process control. A soldering process width of 457 mm (18 inches) is standard.
Solder Nozzle Technologies
Electrovert has set the industry standard in designing solder nozzles that provide the board assemblers with the greatest performance, process flexibility, and process control. Electrovert holds multiple patents on various wave solder technologies. Electrovert’s UltraFill™ solder nozzle is designed to provide maximum top-side hole fill, provide the best hole fill quality, improve first pass yields, reduce dross , and promote easy maintenance.
Preheat Capability
The VectraES is capable of up to 1.8 meters (6 feet) of bottom side preheat and up to 1.2 meters (4 feet) of topside preheat. Multiple types of preheat are offered for complete process flexibility (High velocity forced convection and calrod IR type). The optional quick plug feature allows plug and play preheat configurations that are easy to change.
Fluxing Technologies
As the complexity of board assemblies continues to increase, fluxing quality has become more of a focus to ensure soldering quality is achieved. Electrovert is ahead of competitors and offer the best fluxing technologies available in the marketplace. The ServoJet™ fluxing system provides the ultimate in precision deposition and hole penetration (OA version available for aggressive flux applications) while ServoSonic™ and ServoSpray™ fluxing systems are available for ultrasonic and value based solutions. The VectraES is available with either foam or spray type fluxers.
Operations and Software
Electrovert’s software and operation controls were designed with user interface in mind. The Windows® operating system is multi-functional and easy to use. The 3D GUI provides the user a real-time view of the complete machine modules, operation, and product being soldered. All Electrovert systems have a customizable quick view screen that allows engineers and operators to view critical machine parameters that are important to the process or application.
The patented UltraFill solder nozzle is an ideal solution for lead-free soldering. The UltraFill nozzle is 40% wider than traditional tin-lead nozzle to increase contact time. The nozzle placement reduces the temperature drop between nozzles and improves hole fill. UltraFill allows either air or nitrogen operation through the same design without switching nozzles. Nitrogen or air operation can be selected through the desired recipe, without the need to change nozzles (also available with the rotary chip nozzle).
Electrovert’s full nitrogen tunnel with N2 injection technology feature offers complete process capability and flexibility for all nitrogen soldering applications. The full nitrogen tunnel feature is an efficient design that maintains a very low oxygen environment of <50 ppm which is ideal for increased wetting effects and a significant reduction of dross.Benefits of the full nitrogen tunnel feature include:
Electrovert’s short nitrogen tunnel feature utilizes patented technology that inerts at the solder wave area only. This efficient approach maintains a very low oxygen environment of <50 ppm which is ideal for increased wetting effects and a significant reduction of dross.Benefits of the short nitrogen tunnel feature includes:
ExactaWave is a patented, high-reliability sensor with closed-loop feedback designed to control the solder wave height relative to the board. Its ability withstand temperatures up to 300°C (573°F) makes it perfectly suited for precision soldering applications.The ExactaWave system compensates for changes in solder level, dross accumulation and set-up changes made during maintenance. Thus, a set-point entered in a recipe always produces the same result. The ExactaWave’s seamless integration into the soldering machine’s software also allows it to operate in standby mode and is a parameter that can be data logged with trending capability.
The ServoJet system ensures thorough flux penetration by utilizing concentric air atomization. It offers a programmable method of applying flux that results in consistent flux deposition and reduced flux usage. The ServoJet utilizes air atomized multiple jet technology that is 100% integrated into the wave soldering system software.High end fluxer capabilities include:
ServoJet benefits include:
ServoSpray provides an ideal balance between system performance, functionality and low cost of ownership. ServoSpray has the ability to spray in one or both directions, includes self-clean capability, and features a pressure tank flux supply system. ServoSpray utilizes atomized air delivery technology and is 100% integrated into the wave solder machine software.ServoSpray benefits include:
The ServoSonic is a reciprocating ultrasonic atomizing spray fluxing system. It consists of an ultrasonic atomized spray nozzle and air impact nozzle with an automatic self-cleaning function. The titanium nozzle and horn assemblies make the ServoSonic an ideal solution for high solids and aggressive water soluble fluxes.The ServoSonic benefits include:
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